Teledyne FLIR’s Boson+ thermal camera module product line offers 24 compact models featuring 320x256 resolution. Radiometry, the ability to take the temperature of every pixel, as well as both MIPI and CMOS interfaces, are now also available on all resolutions. With these updates and a thermal sensitivity of 20 millikelvin or less, Boson+ is ideal for integration in unmanned ground vehicles, unmanned aircraft systems, automotive, wearables, security applications, handhelds and thermal sights. Made in the United States, the Boson+ features 640 x 512 and now 320 x 256 resolutions utilizing the latest 12-micron pixel pitch thermal detector within a size, weight and power optimized package. The noise equivalent differential temperature of 20 mK or less offers enhanced detection, recognition and identification performance, especially in low-contrast and low-visibility environments. With improved automatic gain control and video latency compared to previous iterations of Boson, the Boson+ delivers dramatically enhanced scene contrast and sharpness while improving tracking, seeker performance and decision support. It is available with a variety of lens options, comprehensive product documentation, an easy-to-use SDK and a user-friendly GUI. Boson+ is dual use and classified under the U.S. Department of Commerce jurisdiction as EAR 6A003.b.4.a.

Teledyne FLIR |