Teledyne FLIR’s embedded software for the ITAR-free Boson+ thermal camera module delivers high performing uncooled thermal imaging technology for defense, firefighting, automotive, security and surveillance applications. Featuring thermal sensitivity of ≤20 mK, Boson+ provides sharper thermal imagery and improved spatial filtering. Boson+ interfaces seamlessly with the new Teledyne FLIR AVP, an advanced video processor that powers Prism AI and computational imaging at the edge. The AVP, built on the latest Qualcomm QCS8550, efficiently runs Teledyne FLIR Prism AI software providing detection, classification and target tracking. To improve data fidelity and enhance decision support, it also operates Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement and noise reduction. Made in the U.S.A., the 12-micron pixel pitch Boson+ is available in both 320 x 256 and 640 x 512 resolutions. The noise equivalent differential temperature of 20 mK or less offers significantly enhanced detection, recognition and identification performance. Improved video latency enhances tracking, seeker performance and decision support.

Teledyne FLIR | www.flir.com